Last Updated:
The Union Cabinet, led by PM Modi, approved four semiconductor projects worth Rs 4,600 crore, creating 2,034 jobs.
India approves four new semiconductor projects.
The Union Cabinet, chaired by Prime Minister Narendra Modi, has approved four new semiconductor projects under the India Semiconductor Mission (ISM), marking another milestone in India’s bid to build a robust chip-making ecosystem.
The fresh approvals, worth a cumulative Rs 4,600 crore, are expected to create 2,034 skilled jobs directly and many more indirectly. With this, the total number of projects approved under ISM rises to 10, with total planned investments of about Rs 1.60 lakh crore spread across six states.
India is making rapid strides in the semiconductor sector, building a robust ecosystem to power our digital future and drive global innovation. Today’s Cabinet decision relating to approval of semiconductor units in Andhra Pradesh, Odisha and Punjab will boost manufacturing…— Narendra Modi (@narendramodi) August 12, 2025
The newly approved proposals are from 3D Glass Solutions Inc., Continental Device India Private Limited (CDIL), and Advanced System in Package (ASIP) Technologies. SiCSem and 3D Glass will set up facilities in Odisha, CDIL will expand in Punjab, and ASIP will set up operations in Andhra Pradesh.
SiCSem, in collaboration with UK’s Clas-SiC Wafer Fab Ltd., will establish India’s first commercial compound semiconductor fab in Bhubaneshwar with a capacity of 60,000 wafers and 96 million packaged units annually. The devices will cater to sectors such as defence, EVs, railways, data centres, and renewable energy.
3D Glass Solutions will also set up a unit in Bhubaneshwar to bring advanced packaging technology, producing glass interposers, silicon bridges, and 3D Heterogeneous Integration modules for high-performance computing, AI, photonics, and defence applications.
Semiconductor manufacturing comes to AP, driven by a double engine sarkar! I am grateful to the Hon’ble Prime Minister @narendramodi ji for sanctioning a semiconductor manufacturing facility to AP as part of a Rs. 4,600 crore budgetary allocation. Advanced System in Package… pic.twitter.com/WEiHXg8Uce— Lokesh Nara (@naralokesh) August 12, 2025
ASIP Technologies, in a tie-up with South Korea’s APACT Co. Ltd., will set up a semiconductor packaging facility in Andhra Pradesh with an annual capacity of 96 million units for use in mobile devices, automobiles, and consumer electronics.
CDIL will expand its Mohali plant to manufacture high-power devices such as MOSFETs, IGBTs, and Schottky diodes, with an annual capacity of over 158 million units.
With the approval of these projects, the semiconductor ecosystem in the country would get a significant boost as these projects include the country’s first commercial compound fab as well as a highly advanced glass-based substrate semiconductor packaging unit.
These would complement the growing world-class chip design capabilities coming up in the country, which are propelled by design infrastructure support provided by the Government to 278 academic institutions and 72 start-ups.
A team of writers and reporters decodes vast terms of personal finance and making money matters simpler for you. From latest initial public offerings (IPOs) in the market to best investment options, we cover al…Read More
A team of writers and reporters decodes vast terms of personal finance and making money matters simpler for you. From latest initial public offerings (IPOs) in the market to best investment options, we cover al… Read More
view comments
Read More